EDN Asia emails, October 2026
14 emails in October 2026. The busiest day was Tuesday, Oct 27, with 2.
TSMC turning to GF for CoWoS interposers, ASEAN's next tech challenge, and India's new targets
Oct 30, 2026 1:51 AM
FPGA Scaling Raises Single-Event Upset Risks in Terrestrial Applications
Oct 28, 2026 10:10 PM
🔴 LIVE TODAY: EAC2026 Day 2 — Software-Defined Systems & Next-Gen Mobility (Oct 29)
Oct 28, 2026 9:29 PM
🔴 LIVE TODAY: EAC2026 Day 1 Starts at 09:30 (Edge AI · Smart Systems · SDV)
Oct 27, 2026 9:32 PM
ACM Research Targets Panel-level Packaging with Horizontal Plating and Specialized Cleaning
Oct 27, 2026 2:43 AM
Oct 23, 2026 2:01 AM
Emails without a picture
Pictures for these emails are not available yet.
| Sent (Eastern) | Subject |
|---|---|
| Oct 22, 2026 5:22 AM | Lower-Cost IMUs Could Expand Optical Image Stabilization Across Smartphones |
| Oct 20, 2026 2:48 AM | PEN Film Discontinuation Forces Capacitor Designers to Rethink Replacement Strategies |
| Oct 15, 2026 11:35 PM | Hybrid Copper Bonding; Mitra Highlights Funding Gap for India Startups; Chip Industry Breaches $1T |
| Oct 13, 2026 3:55 AM | Hybrid Copper Bonding: A Manufacturing Lever for the AI Era |
| Oct 8, 2026 10:38 PM | Singapore Launches SG Semiconductor; Advancing Taiwan-Singapore AI Collaboration; India Chip Market to Hit $200B by 2035 |
| Oct 7, 2026 10:00 PM | Designing High-Boost-Ratio Converters for Single-Cell Applications |
| Oct 5, 2026 10:00 PM | Zonal Automotive Architecture Raises New Questions for Electrical Troubleshooting |
| Oct 1, 2026 3:18 AM | Optical Interconnect Scaling Becomes an Architectural Challenge |





