Low CTE Substrates with Thermal Inserts for Advanced Heterogeneous Integration

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Wednesday, May 27, 2026 at 12:31 PM EasternActiveCampaign

Spirit ElectronicsLow CTE Substrates with Thermal Inserts for Advanced Heterogeneous Integration

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Subject: Low CTE Substrates with Thermal Inserts for Advanced Heterogeneous Integration
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From: marketing@spiritelectronics.com
Brand: Spirit Electronics
ESP: ActiveCampaign
Sent: Wed May 27, 2026, 12:31 PM ET
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Subject length: 79 characters

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From: Spirit Electronics <[email protected]>
Subject: Low CTE Substrates with Thermal Inserts for Advanced Heterogeneous Integration
Date: Wed, 27 May 2026 16:31:35 +0000 (GMT)
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